四平无引线包
引线键合
接地
连接(主束)
铅(地质)
可靠性(半导体)
计算机科学
工程类
可靠性工程
结构工程
电气工程
材料科学
炸薯条
纳米技术
图层(电子)
物理
地质学
地貌学
胶粘剂
功率(物理)
量子力学
作者
Frederick Ray I. Gomez,Alyssa Grace S. Gablan,Anthony Moreno,Nerie R. Gomez
出处
期刊:Journal of Engineering Research and Reports
[Sciencedomain International]
日期:2021-02-20
卷期号:: 1-5
标识
DOI:10.9734/jerr/2021/v20i317273
摘要
Technological change has brought the global market into broad industrialization and modernization. One major application in the semiconductor industry demands safety and high reliability with strict compliance requirement. This technical paper focuses on the package design solution of quad-flat no leads (QFN) to mitigate the leadframe bouncing and its consequent effect of lifted wire and/or non-stick on leads (NSOL) defects on multi-wire ground connection. Multi-wire on single lead ground (or simply Gnd) connection plays critical attribute in the test coverage risk assessment. Cases of missing wire and/or NSOL on the multi-wire Gnd connection cannot be detected at test resulting to Bin1 (good) instead of Bin5 (open) failure. To ease the failure modes mechanism, a new design of QFN leadframe package with lead-to-diepad bridge-type connection was conceptualized for device with extended leads and with multiple Gnd wires connection. The augmented design would provide better stability than the existing leadframe configurations during wirebonding. Ultimately, the design would help eliminate potential escapees at test of lifted Gnd wire not detected.
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