互连
晶体硅
材料科学
硅
导电体
工程物理
箔法
胶粘剂
纳米技术
光电子学
计算机科学
工程类
电信
复合材料
图层(电子)
作者
G. Beaucarne,Loïc Tous,Jan Lossen,Gunnar Schubert
出处
期刊:Nucleation and Atmospheric Aerosols
日期:2021-01-01
被引量:2
摘要
The 9th edition of the Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells was held as an online event but nevertheless reached the workshop goals of knowledge sharing and networking. The technology of screen-printed contacts of high temperature pastes continues its fast progress enabled by better understanding of the phenomena taking place during printing and firing, and progress in materials. Great improvements were also achieved in low temperature paste printing and plated metallization. In the field of interconnection, progress was reported on multiwire approaches, electrically conductive adhesives and on foil-based approaches. Common to many contributions at the workshop was the use of advanced laser processes to improve performance or throughput.
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