材料科学
焊接
锡
共晶体系
制作
金合金
合金
激光器
半导体
光电子学
集成电路封装
冶金
电子包装
共金键结
复合材料
集成电路
光学
替代医学
病理
物理
医学
作者
Bo Huang,Jinqiang Chen,Zhongliang Qiao,Chunling Liu,Yanping Yao,Xin Gao,Baoxue Bo
摘要
A novel fabrication method and process of Au(80wt.%)-Sn(20wt.%) eutectic alloys solder with excellent thermal, electrical and mechanical properties and relatively low melting and reflow temperature was presented, the characteristic of gold-tin alloy solder and the key technique to realize highly reliable bonding were discussed.
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