压实
路基
岩土工程
模数
刚度
振动
图层(电子)
工程类
结构工程
材料科学
复合材料
声学
物理
作者
Zhiwen Wang,Jinsong Qian,Jianming Ling
摘要
Intelligent compaction (IC) is an innovative and modified technology used for quality control in subgrade digital construction. However, current intelligent compaction measurement values (ICMVs) cannot provide accurate measurement of the filling layer when the strength of the underlying layer is relatively high. Experimental field tests conducted in the cut to fill subgrade were performed to collect and analyze the variability of ICMV called the vibration modulus (Evib). Furthermore, a new ICMV called the modulus of vibration compaction (Evc) that could remove the interference of the underlying layer and reveal the actual compaction state of filling layer is presented based on the theoretical analysis and numerical simulation method. It was also extracted to study the variability of the filling layer’s compaction state. The results of the above research indicate the influence of the underlying layer’s stiffness on overall compaction quality is remarkable. It was found that it is more likely to achieve the variability control of the compaction state of the filling layer by a new ICMV called Evc. The measured data, improved approaches, and associated conclusions that are presented provide valuable information for researchers and employees considering the use of IC technology.
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