Construction of 3D BN network with high-density thermal conductive paths

Efficient heat dissipation is essential to further improve the integration of high-power electronic packaging devices. Three-dimensional BN networks with high-density thermal conductive paths were designed as the heat transfer skeleton of thermal interface materials. 3D networks with high-density thermal conductive paths inlaid between oriented BN paths were constructed using precursor self-assembly and freeze-drying to improve the thermal conductivity of polymeric materials. The results show that high-density thermally conductive paths have stronger polymer-enhanced thermal conductivity than directional thermal paths and compared with pure TPU, the thermal conductivity of TPU/BN-2 under low BN filling content (10%wt) is increased by 250 % and 286.5 % in the through surface and flat surface respectively. This work provides new ideas for the preparation of polymer composites for thermal interface materials in electronic packaging and integrated circuits with excellent thermal management properties.