Experimental and numerical studies of the effect of perforation configuration on heat transfer enhancement of pin fins heat sink

传热 穿孔 材料科学 努塞尔数 散热片 横截面 强迫对流 机械 强化传热 雷诺数 对流换热 热流密度 传热系数 复合材料 机械工程 结构工程 工程类 物理 湍流 冲孔
作者
Ndah Abdulrahman Alpha,Iortyer Humphrey Aondover,Aondoyila Kuhe
出处
期刊:Heat Transfer - Japanese Research [Wiley]
卷期号:53 (5): 2525-2555 被引量:3
标识
DOI:10.1002/htj.23051
摘要

Abstract In this study, experimental and computational studies of the impact of forced convective flow on the heat transfer characteristics of staggered pin fins with perforations are investigated in a rectangular channel at constant heat flux with Reynolds numbers ( Re ) of 2 × 10 3 –12 × 10 3 . In particular, cylindrical pin fins with circular longitudinal (L) perforation, longitudinal/transverse (LT) perforation, and longitudinal/transverse/vertical (LTV) perforation perforations are compared to solid pin fins to find out how adding different perforation arrays affects overall heat transfer performance and also to find the best perforation configuration for maximum performance. ANSYS‐FLUENT is employed for numerical simulation, validated by experimental data. Experimental validation is conducted by attaching the heat sink to a Peltier module, inducing heat generation through current on one face in the Armfield Free and Forced Convection Heat Transfer Service Units HT 19 and HT10XC. Results highlight significant increases in Nusselt number ( Nu ) for perforated pins compared to solid pins, with L perforations at 8%, LT perforations at 33%, and 67% for LTV perforated pins due to transverse perforations that act as slots, which stir up the primary flow and induce secondary flow generated by vertical perforations. Regarding pressure drops, L perforations reduce by 9%, LT by 19%, and LTV by 27% compared to solid pins. The overall enhancement ratio peaks at the minimum Reynold number, notably achieving a 38% increase in the LTV perforation pin fin array. This innovative study holds promise for diverse electronic applications, offering enhanced heat transfer performance in electronic cooling systems.

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