材料科学
聚酰亚胺
纳米复合材料
二硫化钼
电介质
剥脱关节
复合材料
复合数
介电强度
介电常数
极限抗拉强度
石墨烯
纳米技术
光电子学
图层(电子)
作者
Dekang Cheng,Huan Wang,Bin Liu,Shan Wang,Yang Li,Yushuang Xia,Chuanxi Xiong
摘要
ABSTRACT Flexible dielectric materials with high electric energy density and high‐temperature resistant characteristic are of great importance for modern electronics and electrical systems. Herein, two‐dimensional molybdenum disulfide (MoS 2 ) nanosheets were efficiently produced via liquid‐phase exfoliation and then incorporated into polyimide (PI) to prepare MoS 2 /PI dielectric nanocomposites. Compared to the pristine PI, MoS 2 /PI nanocomposite films exhibited much larger dielectric permittivity while their dielectric losses still maintained relatively low levels. On the other hand, the Weibull breakdown strength of these nanocomposite films initially increased and then decreased with the increase in the MoS 2 content and gave rise to a maximum value of 395 MV m −1 at 1 vol % loading. Combination of the improved dielectric permittivity and breakdown strength makes the MoS 2 /PI nanocomposite film with 1 vol % MoS 2 possess an elevated energy density of about 3.35 J cm −3 . Moreover, good tensile and thermal properties of the nanocomposite films hold great promise for their applications in high‐temperature and harsh conditions. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 47991.
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