材料科学
Burgers向量
位错
线程(蛋白质序列)
GSM演进的增强数据速率
薄脆饼
六方晶系
结晶学
基质(水族馆)
复合材料
光电子学
计算机科学
人工智能
核磁共振
地质学
化学
物理
海洋学
蛋白质结构
作者
Yongzhao Yao,Yukari Ishikawa,Yoshihiro Sugawara,Koji Sato,Katsunori Danno,Hiroshi Suzuki,Hidemitsu Sakamoto,Takeshi Bessho,S. Yamaguchi,Koichi Nishikawa
出处
期刊:Materials Science Forum
日期:2014-02-26
卷期号:778-780: 346-349
被引量:3
标识
DOI:10.4028/www.scientific.net/msf.778-780.346
摘要
In this paper, we report a newly developed dislocation-revealing etch pit method for 4H-SiC single crystal, which can distinguish edge (TED, Burgers vector b = a ), elementary screw (TSD, b =1 c ) and mixed (TMD, b = c + a ) threading dislocations. In this method, vaporized NaOH gas was used to etch the Si-face of a SiC wafer at substrate temperature around 950 °C. By a side-by-side comparison between the optical images of the etch pits and the X-ray topographic (XRT) images, it has been found that threading dislocations (TDs) in SiC could be revealed as hexagonal etch pits with distinct geometrical features (shape, size and facet orientation) depending on their Burgers vectors. Based on these results, we consider this etch pit method as an easily-operated and inexpensive technique to categorize TDs, and it may help to promote our understanding on the different roles that these types of TDs have played in the performance degradation of SiC power devices.
科研通智能强力驱动
Strongly Powered by AbleSci AI