Intelligent microcooling systems on electronic printed circuit boards

The rapidly rising integration density and clock frequencies of the electronic components and the constantly growing number of functions leads to a integration density and cooling problem in the components on the electronic printed circuit board. This is demonstrated here with the example of transmission techniques in telecommunications. The development of bit rate through glass fiber cables has currently reached the range from 140 Mbit/s to 2.5 Gbit/s and now to 160 Gbit/s. In the solutions applied today, of integration density are exhausted and mechanically complicated. The difficulty of introducing and applying key components quickly, inexpensively, and without the limitations of functionality requires an intelligent and flexible integration method and a new cooling concept like that which is described here.