A study of substrate damage issue caused SRAM device soft failure

In this paper, we focus on how to identify the influence of device cause by substrate damage issue via nanoprobing analysis, and inferring that the equivalent mathematical models was application to describe the corresponding electrical data in a device with substrate damage issue. A case study was presented to verify that poor Poly etching process control caused substrate damage issue, and this issue can be identified via physical failure analysis (PFA) method (e.g. Transmission Electron Microscope (TEM) and Focus Ion Beam (FIB) techniques) and nanoprobing analysis method.