Silver Nanowires: From Scalable Synthesis to Recyclable Foldable Electronics

Advanced MaterialsVolume 23, Issue 27 p. 3052-3056 Communication Silver Nanowires: From Scalable Synthesis to Recyclable Foldable Electronics Cheng Yang, Corresponding Author Cheng Yang yangch@ust.hk Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Cheng Yang, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Matthew M. Yuen, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Ching Ping Wong, School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA.Search for more papers by this authorHongwei Gu, Hongwei Gu Key Laboratory of Organic Synthesis of Jiangsu Province, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou 215123, ChinaSearch for more papers by this authorWei Lin, Wei Lin School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USASearch for more papers by this authorMatthew M. Yuen, Corresponding Author Matthew M. Yuen meymf@ust.hk Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Cheng Yang, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Matthew M. Yuen, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Ching Ping Wong, School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA.Search for more papers by this authorChing Ping Wong, Corresponding Author Ching Ping Wong cp.wong@mse.gatech.edu School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA Faculty of Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong Cheng Yang, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Matthew M. Yuen, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Ching Ping Wong, School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA.Search for more papers by this authorMingyong Xiong, Mingyong Xiong Department of Chemical and Biomolecular Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaSearch for more papers by this authorBo Gao, Bo Gao Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaSearch for more papers by this author Cheng Yang, Corresponding Author Cheng Yang yangch@ust.hk Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Cheng Yang, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Matthew M. Yuen, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Ching Ping Wong, School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA.Search for more papers by this authorHongwei Gu, Hongwei Gu Key Laboratory of Organic Synthesis of Jiangsu Province, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou 215123, ChinaSearch for more papers by this authorWei Lin, Wei Lin School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USASearch for more papers by this authorMatthew M. Yuen, Corresponding Author Matthew M. Yuen meymf@ust.hk Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Cheng Yang, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Matthew M. Yuen, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Ching Ping Wong, School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA.Search for more papers by this authorChing Ping Wong, Corresponding Author Ching Ping Wong cp.wong@mse.gatech.edu School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA Faculty of Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong Cheng Yang, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Matthew M. Yuen, Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China Ching Ping Wong, School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA.Search for more papers by this authorMingyong Xiong, Mingyong Xiong Department of Chemical and Biomolecular Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaSearch for more papers by this authorBo Gao, Bo Gao Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaSearch for more papers by this author First published: 17 May 2011 https://doi.org/10.1002/adma.201100530Citations: 264Read the full textAboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat Abstract A scalable preparation method for high-quality silver nanowires (Ag NWs), which can be used as the electrical circuits for a broad spectrum of ultralow-cost, recyclable, foldable electronics, is presented. Paper-based radio-frequency identification (RFID) tags, light-emitting diode (LED) chip arrays, and 3D origami electrical devices are synthesized. The signal transmittance and biodecomposition of the RFID tags are investigated. Citing Literature Supporting Information Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Filename Description adma_201100530_sm_suppl.pdf3 MB suppl Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article. Volume23, Issue27July 19, 2011Pages 3052-3056 RelatedInformation