Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis

To evaluate the peel resistance of a device wherein a polyimide (PI) sheet is bonded to a curved surface with a pressure-sensitive adhesive (PSA) experimentally and analytically, we applied a mechanical simulation considering the viscoelasticity of the pressure-sensitive adhesive (PSA) and the fracture energy of the bonding interface. The mechanical behavior against the local load applied on the PI sheet surface was evaluated using this simulation. To verify the accuracy of this simulation, we fabricated a local load tester that could apply a load to a local area of 8 mm in diameter and compared the mechanical behavior with the simulation results. Dynamic mechanical analysis of the PSA with a film thickness of 19 μm was performed using the nanoindentation technique. The generalized Maxwell model parameters were estimated by fitting the relaxation elastic modulus E(t) to conduct a mechanical simulation. For the double cantilever beam test to derive the interfacial fracture energy, soft PI sheets were reinforced with Al substrates. As a result of these analyses, it was confirmed that the relationship between the displacement and load obtained by this simulation agrees well with the actual local load test. This technique is useful for predicting the bonding strength of complex-shaped devices fabricated using soft adherends and adhesives.