泥浆
蓝宝石
薄脆饼
化学机械平面化
抛光
材料科学
复合材料
纳米技术
光学
物理
激光器
作者
Wenxiang Xie,Zhenyu Zhang,Longxing Liao,Jie Liu,Hongjiu Su,Shudong Wang,Dongming Guo
出处
期刊:Nanoscale
[Royal Society of Chemistry]
日期:2020-01-01
卷期号:12 (44): 22518-22526
被引量:166
摘要
Toxic and corrosive solutions are widely used in the preparation of abrasives and chemical mechanical polishing (CMP) of sapphire wafers, resulting in potential environmental pollution.
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