Lv41
546 积分 2023-06-26 加入
Development of Scalable Silicon Heat Spreader for High Power Electronic Devices
41分钟前
已完结
Design, fabrication and test of silicon heat pipes with radial microcapillary grooves
46分钟前
已完结
Silicon heat pipes used as thermal spreaders
1小时前
已完结
Pool Boiling Enhancement via Surface Engineering for Thermal Management
3小时前
求助中
Design Optimization of Graded Three-Dimensional Micropillar Wicks for Vapor Chamber Evaporators
3小时前
已完结
Structure Reliability Analysis of Embedded MicroChannel Cooling with PCB Manifold
3小时前
已完结
Embedded cooling method with monolithic dual-layer microchannel cold plate for high-power chips
3小时前
已完结
Research on Efficient Charging and Highly Reliable Non-Contact Welding Sealing Technology for Ultra-Thin Silicon-Based Vapor Chambers
3小时前
求助中
Design Optimization of Graded Three-Dimensional Micropillar Wicks for Vapor Chamber Evaporators
1天前
待确认
Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps
3个月前
已完结
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