Lv4
766 积分 2023-06-26 加入
A novel thermal management scheme of 3D-IC based on loop heat pipe
1个月前
已完结
Experimental study on flow optimization and thermal performance enhancement of an ultrathin silicon-based loop heat pipe
1个月前
已完结
Experimental study on ultra-thin silicon-based VC for chip-level heat dissipation
1个月前
已完结
Moisture-Induced Die Stresses in PBGA Packages Exposed to Various Environments
1个月前
已完结
Piezoelectric micropump cooler for high-power electronic cooling
1个月前
已完结
A Model of Low‐Temperature Wafer Bonding And Its Applications
4个月前
已完结
Evaluation of Wafer Bond Strength under Vacuum
4个月前
已完结
A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers
4个月前
已完结
Research progress of hybrid bonding technology for three-dimensional integration
4个月前
已完结
A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies
4个月前
已完结
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