极紫外光刻
极端紫外线
材料科学
失真(音乐)
吸收(声学)
光学
热变形温度
变形(气象学)
平版印刷术
临界尺寸
图层(电子)
热的
光电子学
复合材料
物理
放大器
气象学
极限抗拉强度
艾氏冲击强度试验
激光器
CMOS芯片
作者
Chung-Hyun Ban,Eun‐Sang Park,Ui-Jeong Ha,Chae-Yun Lim,Hye-Keun Oh
摘要
Extreme ultraviolet lithography (EUVL) uses reflective optics due to the high absorption of EUV sources, and EUV masks consist of multiple layers of composites to increase reflectance. As repeated exposure proceeded, heat accumulation due to energy absorption and resulting heat deformation were observed in each layer constituting the EUV mask. In particular, the absorber is made of a material with high absorption rate, so the temperature accumulation and deformation are different depending on the part with and without the absorber. This means that thermal distortion can cause mask overlay and local critical dimension uniformity (LCDU) problems, resulting in lower process yields. In this paper, we will examine the temperature accumulation and heat deformation depending on the presence of absorber when electrostatic chuck (ESC) and hydrogen cooling are applied.
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