Robust Multifunctional Films with Excellent EMI Shielding, Anti‐Peeling, and Joule Heating Performances Enabled by an Encapsulated Highly Conductive Fabric Strategy

Abstract Recently, the issue of electromagnetic pollution has become increasingly prominent. Flexible polymer films with various conductive fillers are preferred to address this problem due to their highly efficient and durable electromagnetic interference (EMI) shielding performance. However, their applications are restricted by the unbalanced and insufficient electromagnetic wave absorption and shielding capabilities, as well as the weak interlayer bonding force. In this work, robust flexible multifunctional AgNW/MXene/NiCo‐C (AMN) films are fabricated by hierarchical casting assembly and an encapsulated conductive fabric strategy. The synergistic effect of the conductive‐absorption integrated sandwich core fabric and the conductive encapsulation layer collaborate to provide excellent absorption‐dominated EMI shielding (EMI SE max = 89.12 dB with an ultralow reflectivity value of 0.19) and Joule heating (a high temperature of 103.5 °C at 4.5 V) performances. Besides, AMN films with embedded fabrics as a reinforcement structure achieved enhanced peel (1.97 N mm −1 ) and tensile (7.85 MPa) strengths through an interface enhancement process (plasma and pre‐immersion treatments). In conclusion, this paper proposes a feasible paradigm to prepare flexible multifunctional conductive films, which demonstrate tremendous potential for applications in the wearable electronics and aerospace fields.