波束赋形
CMOS芯片
像素
传感器
计算机科学
炸薯条
巨量平行
电子工程
信号(编程语言)
频道(广播)
还原(数学)
计算机硬件
声学
工程类
人工智能
电信
物理
并行计算
程序设计语言
几何学
数学
作者
Man-Chia Chen,Aldo Peña Pérez,Sri‐Rajasekhar Kothapalli,Philippe Cathelin,Andreia Cathelin,Sanjiv S. Gambhir,Boris Murmann
标识
DOI:10.1109/isscc.2017.7870458
摘要
A variety of emerging applications in medical ultrasound rely on 3D volumetric imaging, calling for dense 2D transducer arrays with thousands of elements. Due to this high channel count, the traditional per-element cable interface used for 1D arrays is no longer viable. To address this issue, recent work has proven the viability of flip-chip bonding or direct transducer integration. This shifts the burden to a CMOS substrate, which must provide dense signal conditioning and processing before the massively parallel image data can be pushed off chip. A common approach for data reduction is to employ subarray beamforming (BF), which applies delay and sum operations within a group of pixels. To implement such functionality within the tight pixel pitch, prior works have implemented the delays using simple S/H circuits or analog filters, and typically suffer from a combination of issues related to limited delay, coarse delay resolution and limited SNR.
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