材料科学
聚合
沉淀聚合
铜
聚合物
水溶液中的金属离子
乙二醇二甲基丙烯酸酯
超临界二氧化碳
高分子化学
超临界流体
自由基聚合
化学工程
核化学
无机化学
金属
化学
有机化学
甲基丙烯酸
复合材料
工程类
冶金
作者
Lijuan Zhang,Liqin Cao,Xiaohu Wang,Jide Wang
摘要
The temperature‐sensitive Cu(II) ion imprinted polymer (Cu(II)‐MIIP) materials were prepared via precipitation polymerization methods in supercritical carbon dioxide (scCO 2 ) by using methanol as cosolvent. In the polymerization process, the polymerization mixture consists of copper ion, N ‐isopropylacrylamide (functional monomer), ethylene glycol dimethacrylate (crosslinker), and 2,2′‐azobisisobutyronitrile (initiator). Non‐imprinted polymer particles were similarly prepared in the same way except for the presence of copper ion in the polymerization reaction. In this study, the characteristic of swelling/shrinking for Cu(II)‐MIIP in response to the change in temperature was investigated by scanning electron microscopy and photograph of swelling/shrinking for Cu(II)‐MIIP in deionized water. The above‐synthesized polymer particles were characterized by using Fourier transform infrared, thermo‐gravimetric analysis, and X‐ray diffraction techniques. Furthermore, the complete removal of the copper metal ion from the CuP was confirmed by atomic absorption spectroscopy. The selectivity adsorption of polymer materials was investigated from dilute aqueous solutions, and it was found to have an imprinting efficiency of 2.13 for Zn and Co ions. Copyright © 2011 John Wiley & Sons, Ltd.
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