Carbon Nanofiber/Polyaniline Composite Aerogel with Excellent Electromagnetic Interference Shielding, Low Thermal Conductivity, and Extremely Low Heat Release

气凝胶 材料科学 聚苯胺 热导率 复合材料 复合数 电磁屏蔽 碳纳米纤维 纳米纤维 原位聚合 阻燃剂 保温 掺杂剂 碳纳米管 兴奋剂 聚合物 图层(电子) 光电子学 聚合
作者
Mingyi Chen,Jian Zhu,Kai Zhang,Hongkang Zhou,Yufei Gao,Jie Fan,Rouxi Chen,Hsing‐Lin Wang
出处
期刊:Nano-micro Letters [Springer Science+Business Media]
卷期号:17 (1) 被引量:2
标识
DOI:10.1007/s40820-024-01583-2
摘要

Abstract The rapid development of communication technology and high-frequency electronic devices has created a need for more advanced electromagnetic interference (EMI) shielding materials. In response to this demand, a study has been conducted to develop multifunctional carbon nanofibers (CNFs)/polyaniline (PANI) aerogels with excellent electromagnetic interference shielding, flame retardancy, and thermal insulation performance. The process involved freeze-drying of electrospun CNFs and PANI nanoparticles followed by in situ growth PANI to coat the CNFs, creating the core–shell structured CNFs/PANI composite fiber and its hybrid aerogels (CP-3@PANI). The interaction between PANI and aniline (ANI) provides attachment sites, allowing additional ANI adsorption into the aerogel for in situ polymerization. This results in PANI uniformly covering the surface of the CNFs, creating a core–shell composite fiber with a flexible CNF core and PANI shell. This process enhances the utilization rate of the ANI monomer and increases the PANI content loaded onto the aerogel. Additionally, effective connections are established between the CNFs, forming a stable, conductive three-dimensional network structure. The prepared CP-3@PANI aerogels exhibit excellent EMI shielding efficiency (SE) of 85.4 dB and specific EMI SE (SE d −1 ) of 791.2 dB cm 3 g⁻ 1 in the X-band. Due to the synergistic flame-retardant effect of CNFs, PANI, and the dopant (phytic acid), the CP-3@PANI aerogels demonstrate outstanding flame-retardant and thermal insulation properties, with a peak heat release rate (PHRR) as low as 7.8 W g⁻ 1 and a total heat release of only 0.58 kJ g⁻ 1 . This study provides an effective strategy for preparing multifunctional integrated EMI shielding materials.
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