可靠性(半导体)
碳化硅
材料科学
压力(语言学)
MOSFET
降级(电信)
晶体管
光电子学
功率半导体器件
工程物理
栅氧化层
电气工程
功率(物理)
工程类
电压
复合材料
量子力学
物理
哲学
语言学
出处
期刊:Iet Power Electronics
[Institution of Electrical Engineers]
日期:2020-02-01
卷期号:13 (3): 445-455
被引量:54
标识
DOI:10.1049/iet-pel.2019.0587
摘要
SiC MOSFETs (silicon carbide metal-oxide semiconductor field-effect transistors) are replacing Si insulated gate bipolar transistors in many power conversion applications due to their superior performance. However, ruggedness and reliability of SiC MOSFETs are still big concern for their widespread applications in the market, especially in safety-critical applications. The objective of this study is to provide a comprehensive picture on the ruggedness and reliability of commercial SiC MOSFETs, discover their failure or degradation mechanism, and propose some possible mitigation methods through both literature survey and in-depth analysis. The ruggedness of SiC MOSFETs discussed here includes short-circuit (SC) ruggedness, avalanche ruggedness, and their failure mechanism. The reliability issues include gate oxide reliability, degradation under high-temperature bias stress, repetitive SC stress, avalanche stress, power cycling stress, body diode's surge current stress, and their degradation mechanism. Furthermore, this study discusses methods and solutions to improve their ruggedness and reliability.
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