The effect of Cl(I)− ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

Abstract The influence of Cl(I)− ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate was investigated. For this investigation the galvanostatic single-pulse method has been used. The results indicate that Cl(I)− ions change the exchange current density and transfer coefficients as determined from tafel analyses of the anodic and cathodic reactions.