Ultrathin, Flexible, and Reusable Silicon Shadow Masks Manipulated via Transfer Printing

Stencil lithography is a facile patterning technique that offers a potential solution to the limitations of conventional photolithography. However, several critical factors such as enhanced pattern resolution, ability to pattern on nonplanar surfaces, and multilayer patterning should further be addressed to extend the applications of stencil lithography. This study presents a novel ultrathin silicon shadow mask which is flexible, reusable, and able to be precisely aligned and manipulated through transfer printing. The small thickness of the silicon shadow mask inherently provides it with the enhanced resolution patterning on both planar and nonplanar surfaces. To highlight these attractive benefits, substrates are patterned with metal deposition as well as by etching in a multilayer configuration. Moreover, it is found that the pattern resolution which is degraded as the shadow mask is repeatedly coated with metal and becomes warped can be restored after the mask cleaning procedure, demonstrating its effective reusability. Finally, as a device‐level application, top contact/bottom gate organic thin film transistor arrays are fabricated on both planar and curved surfaces using the shadow mask. These results show the promise of stencil lithography as a versatile and reliable high resolution patterning method for various applications by exploiting the presented ultrathin silicon shadow mask.