Plasma induced damage on AlGaN/GaN heterostructure during gate opening for power devices

During the fabrication of metal oxide semiconductor high electron mobility transistor based on AlGaN/GaN heterostructure, gate patterning is recognized as the most critical step that can lead to electrical degradation of the transistor. In this work, we performed the SiN cap layer plasma etching processes by two fluorine-based plasma processes (SF6/Ar and CHF3/CF4/Ar) with low (≈15 eV) and high (≈260 eV) ion energies. Moreover, we investigate the postetching treatment using a KOH solution in order to restore the quality of the AlGaN barrier surface after etching. The objective of this article is to evaluate the AlGaN barrier surface damage after the listed plasma etching processes and postetching strategies by using quasi-in situ angle-resolved x-ray photoelectron spectroscopy, transmission electron microscopy, and atomic force microscope. Accordingly, it is found that both high ion energy plasma processes lead to a significant stoichiometric change and modification of the AlGaN barrier layer into a 1.5 nm F-rich AlGaNFx subsurface reactive layer. The decrease in ionic energy leads to a decrease in the SiN etch rate and a significant improvement in the SiN/AlGaN etch selectivity (which becomes infinite) for both plasma chemistries. Moreover, the decrease in ion energy decreases the depth of the modification (about 0.5 nm) and reduces the stochiometric change of the AlGaN barrier layer. However, both low and high ion energy SF6/Ar plasma lead to 0.8 eV Fermi level shift toward the valence band. Furthermore, the KOH postetching treatment demonstrates complete and effective removal of the AlGaNFx subsurface reactive layer and restoration of the surface properties of the AlGaN layer. However, this removal leads to AlGaN recesses that are correlated to the thickness of the reactive layer formed during the etching.