材料科学
复合材料
聚合物
导电体
制作
热导率
导电聚合物
纳米尺度
工作(物理)
数码产品
填料(材料)
导电的
纳米技术
机械工程
电气工程
病理
工程类
替代医学
医学
作者
Shahriar Ghaffari‐Mosanenzadeh,Omid Aghababaei Tafreshi,Erik Dammen‐Brower,Elmira Rad,Mohammad Meysami,Hani E. Naguib
摘要
Abstract Polymers are known as thermally insulated materials with reported effective thermal conductivity (K eff ) in the range of 0.1 to 0.5 Wm −1 K −1 . However, increasing demand for smaller and more powerful electronics has created the need for thermally conductive polymers for use in heat exchangers and electronic packaging applications. Given this background, much research has been done over the past two decades to increase the K eff of polymers. Based on the strategy involved, those works can be divided into two main categories: (i) increasing the K eff of the neat polymer by aligning its chains orientation; and (ii) increasing polymer K eff by fabrication of polymeric composites with thermally conductive filler networks. Among these two strategies, the former is limited to nanoscale laboratory research and is difficult to scale up for mass production. Therefore, this work is mainly focused on the latter category, thermally conductive polymeric composites, which has a higher potential for large‐scale production. This work aims to summarize, evaluate, and highlight the successful strategies of the recent efforts in enhancing the thermal conductivity of polymer composites. The major achievements, future challenges, and the outlooks of high thermally conductive polymeric composites are presented by analyzing the results of about 300 works.
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