砷化镓
材料科学
焊接
模具(集成电路)
镓
半导体
集成电路封装
GSM演进的增强数据速率
冶金
砷化物
光电子学
复合材料
集成电路
纳米技术
计算机科学
电信
作者
G. Humpston,David M. Jacobson
出处
期刊:Gold Bulletin
[Springer Nature]
日期:1989-09-01
卷期号:22 (3): 79-91
被引量:9
摘要
Gold plays an important role in leading-edge semiconductor technologies based on gallium arsenide. This metal is used extensively in contact metallizations and in solders for bonding gallium arsenide devices into packages. The quality of soldered joints made to this semiconductor depends critically on the choice of the metallization/solder combination and bonding temperature. A set of design guidelines for achieving sound joints has been derived from a metàllurgical study, which encompassed a representative selection of metallizations and solders employed in industry.
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