硅光子学
光子学
绝缘体上的硅
材料科学
硅
薄脆饼
光电子学
铸造厂
CMOS芯片
计算机科学
工程类
机械工程
作者
Ken Giewont,Shuren Hu,Bo Peng,Michał Rakowski,Stewart E. Rauch,Jessie Rosenberg,Aslı Şahin,Ian Stobert,Andy Stricker,Karen Nummy,Frederick A. Anderson,Javier Ayala,Tymon Barwicz,Yusheng Bian,Kevin Dezfulian,D. M. Gill,Thomas Houghton
标识
DOI:10.1109/jstqe.2019.2908790
摘要
A competitive 300-mm silicon photonics foundry technology has been developed by GLOBALFOUNDRIES for general availability, which takes advantage of advanced CMOS process technology and provides a manufacturing scale. A state-of-the-art process design kit offers a codesign environment with access to a comprehensive photonics device library along with a monolithically integrated SOI CMOS device library. Advances in automated wafer-level optical test enable statistical photonic device characterization for development, photonic modeling, and manufacturing controls. The key challenges and solutions in developing a manufacturable photonic technology with state-of-the-art performance are described, as well as a roadmap for next generation high-performance monolithic silicon photonics are outlined.
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