去湿
材料科学
图层(电子)
复合材料
壳体(结构)
粒径
扩散
粒子(生态学)
纳米技术
化学工程
润湿
热力学
海洋学
物理
地质学
工程类
作者
Eun Byeol Choi,Jong‐Hyun Lee
标识
DOI:10.1016/j.apsusc.2019.02.221
摘要
With the aim of application as either a conductive filler or a sinter-bonding material with enhanced antioxidation properties, Ag-coated Cu ([email protected]) particles with thick Ag shells were fabricated and heated at 220 °C for 10 min in air to observe the dewetting behavior of the thick Ag shell. The fabricated [email protected] particles were spherical with the average size of 2 μm, and the Ag shell was 250–400 nm in thickness, comprising a mixed Ag-Cu layer and a dense Ag layer. As the heat-treatment time increased, the [email protected] particles were aggregated by forming numerous Ag nodules covering the surface of the particle. Dewetting in the thick Ag shell occurred from 4 min and only in the outer layer of the Ag shell even after 10 min of heat-treatment. In addition, the thickness of the dewetting layer and the mixed Ag-Cu layer were increased because the outward diffusion of Cu and Ag were increased proportionally with the time. However, because the dense Ag layer remained even after the dewetting of the Ag shell and the formation of the mixed Ag-Cu layer, the [email protected] particles were not oxidized after heating at 220 °C for 10 min in air.
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