负偏压温度不稳定性
阈值电压
材料科学
MOSFET
金属浇口
泄漏(经济)
CMOS芯片
光电子学
晶体管
场效应晶体管
电气工程
电压
工作职能
可靠性(半导体)
短通道效应
栅氧化层
纳米技术
功率(物理)
工程类
物理
图层(电子)
经济
宏观经济学
量子力学
作者
Wen-Teng Chang,Meng-His Li,Chun-Hao Hsu,W. C. Lin,Wen‐Kuan Yeh
标识
DOI:10.1109/ojnano.2021.3109897
摘要
High-k metal gate technology improves the performance and reduces the gate leakage current of metaloxidesemiconductor field-effect transistors (MOSFETs). This study investigated four different work function metal (WFM) stacks in the gate of fin field-effect transistors (FinFETs) on the same substrate. These devices not only successfully produced distinct levels of threshold voltages (|Vt|) but also converted n- to p-type features merely by adding p-type WFM in the gate of the MOSFETs. All of the devices satisfied short-channel effects with shrinking channel length. The gate-to-body electric field induced drain leakage due to the nature of bulk FinFETs. However, the n- and p-type gate stacks presented different gate current leakage. For reliability, hot carrier injection (HCI) could have a higher reliability impact than the negative-bias temperature instability (NBTI) for p-MOSFET, although the stress voltage of HCI was roughly half that of the NBTI test. This multi-threshold voltage tuning allows designers to design CMOS and choose the trade-off between low power consumption and high performance on the same platform.
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