材料科学
碎屑形成
机械加工
可加工性
复合材料
脆性
变形(气象学)
破损
GSM演进的增强数据速率
前角
硬化(计算)
刀具磨损
冶金
图层(电子)
计算机科学
电信
作者
Ziwen Xia,Chenwei Shan,Menghua Zhang,Wengang LIU,Minchao Cui,Ming Luo
标识
DOI:10.1016/j.cja.2024.06.005
摘要
Superior strength and high-temperature performance make γ-TiAl vital for lightweight aero-engines. However, its inherent brittleness poses machining problems. This study employed Elliptical Ultrasonic Vibration Milling (EUVM) to address these problems. Considering the influence of machining parameters on vibration patterns of EUVM, a separation time model was established to analyze the vibration evolutionary process, thereby instructing the cutting mechanism. On this basis, deep discussions regarding chip formation, cutting force, edge breakage, and subsurface layer deformation were conducted for EUVM and Conventional Milling (CM). Chip morphology showed the chip formation was rooted in the periodic brittle fracture. Local dimples proved that the thermal effect of high-speed cutting improved the plasticity of γ-TiAl. EUVM achieved a maximum 18.17% reduction in cutting force compared with CM. The force variation mechanism differed with changes in the cutting speed or the vibration amplitude, and its correlation with thermal softening, strain hardening, and vibratory cutting effects was analyzed. EUVM attained desirable edge breakage by achieving smaller fracture lengths. The fracture mechanisms of different phases were distinct, causing a surge in edge fracture size of γ-TiAl under microstructural differences. In terms of subsurface deformation, EUVM also showed strengthening effects. Noteworthy, the lamellar deformation patterns under the cutting removal state differed from the quasi-static, which was categorized by the orientation angles. Additionally, the electron backscattering diffraction provided details of the influence of microstructural difference on the orientation and the deformation of grains in the subsurface layer. The results demonstrate that EUVM is a promising machining method for γ-TiAl and guide further research and development of EUVM γ-TiAl.
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