Ductile–brittle transition and ductile-regime removal mechanisms in micro- and nanoscale machining of ZnS crystals

The ductile–brittle transition and ductile-regime removal mechanisms of ZnS crystal, a typical soft-brittle infrared optical material, have remained unclear at the micro- and nanoscale. In this context, this study modeled the energies consumed in two machining modes, namely ductile deformation and brittle fracture, during the ultraprecision cutting of ZnS crystal. Subsequently, based on the transition point of the energy mode, the critical undeformed chip thickness (CUCT) for the ductile–brittle transition of the material was determined. Additionally, the effect of tool parameters on CUCT was quantitatively analyzed, and the correctness of the model was verified by scratch experiments. Moreover, the cutting parameters that affect the maximum undeformed chip thickness (MUCT) were analyzed. By comparing the MUCT and CUCT, the cutting conditions to realize ductile-regime machining were predicted. The correctness of the ductile-regime machining conditions was also verified through surface quality characterization after face-cutting experiments. The MUCT can be controlled to be less than the CUCT by using a cutting tool with a sufficiently large tool rake angle, a nose radius and a reduced feed rate, thus realizing the ductile-regime removal of the material. The surface morphology, chip morphology, and surface roughness of machined ZnS crystal confirmed the validity of the model. Using a diamond cutting tool with a large cutting edge angle (–25°) and nose radius (1.2 mm) as well as a low feed rate (0.5 μm/rev) and depth of cut (3 μm), the generation of cracks and pits was effectively inhibited, resulting in a smooth surface with a surface roughness of 1.60 nm. Overall, the findings of this study provide important insights into the superfinishing of soft–brittle materials such as ZnS crystal.