电镀
材料科学
涂层
极化(电化学)
扫描电子显微镜
电镀(地质)
铜
衍射
镀铜
冶金
化学工程
复合材料
光学
化学
物理
地质学
工程类
物理化学
图层(电子)
地球物理学
出处
期刊:Materials protection
日期:2009-01-01
摘要
A novel combinatory brightening agent was used for Cu electropla-ting in an alkaline bath.The effect of composition of the brighte-ning agent on the polarization ability of the plating solution was examined by making use of polarization curve measurement,Hell Journal of Materials Protection cell test,and scanning electron microscopy and X-rav diffraction analysis.At the same time,the bonding strength,morphology,composition,and crystal structure of the electroplated Cu coating were analyzed.It was found that the four kinds of additives intro-duced into the combinatory brightening agent were all able to in-crease the polarization ability of the plating solution and func-tioned in different ways during Cu electroplating.The Cu coating obtained at a current density of 1~ 10 A/dm2 was composed of fine Cu grains.Moreover,when the Cu coating was relatively thinner,it tended to grow with preferential orientation along(111) and(220) planes while the coating with a moderate thick-ness tended to grow with preferential orientation along(111) plane.
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