十字线
极紫外光刻
光掩模
光学
计量学
相干衍射成像
材料科学
相(物质)
衍射
样品(材料)
极端紫外线
相位恢复
表征(材料科学)
光电子学
计算机科学
物理
抵抗
薄脆饼
纳米技术
激光器
傅里叶变换
热力学
量子力学
图层(电子)
作者
Iacopo Mochi,Sara Fernández,Ricarda Nebling,Uldis Locāns,Rajeev Rajendran,Atoosa Dejkameh,Dimitrios Kazazis,Li‐Ting Tseng,Serhiy Danylyuk,Larissa Juschkin,Yasin Ekinci
出处
期刊:Journal of Micro-nanolithography Mems and Moems
[SPIE - International Society for Optical Engineering]
日期:2020-01-30
卷期号:19 (01): 1-1
被引量:11
标识
DOI:10.1117/1.jmm.19.1.014002
摘要
Background: Reliable photomask metrology is required to reduce the risk of yield loss in the semiconductor manufacturing process as well as for the research on absorber materials. Actinic pattern inspection (API) of EUV reticles is a challenging problem to tackle with a conventional approach. For this reason, we developed RESCAN, an API platform based on coherent diffraction imaging. Aim: We want to verify the sensitivity of our platform to absorber and phase defects. Approach: We designed and manufactured two EUV mask samples with absorber and phase defects, and we inspected them with RESCAN in die-to-database mode. Results: We reconstructed an image of an array of programmed absorber defects, and we created a defect map of our sample. We inspected two programmed phase defect samples with buried structures of 3.5 and 7.8 nm height. Conclusions: We verified that RESCAN, in its current configuration, can detect absorber defects in random patterns and buried (phase) defects down to 50 × 50 nm2.
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