母线
温度循环
铜
异质结
光电子学
丝网印刷
电镀(地质)
互连
计算机科学
材料科学
镀铜
硅
电气工程
太阳能电池
电镀
热的
复合材料
冶金
图层(电子)
工程类
气象学
地质学
物理
计算机网络
地球物理学
作者
Yao Yu,P. Papet,J. Hermans,T. Söderström,H. Mehlich,M. König,A. Waltinger,D. Habermann,André Richter
出处
期刊:Photovoltaic Specialists Conference
日期:2015-06-01
被引量:4
标识
DOI:10.1109/pvsc.2015.7355648
摘要
SmartWire Connection Technology (SWCT) developed by Meyer Burger uses multiple thin copper wires with alloy coating to interconnect solar cells. These thin copper wires separate a 156 mm solar cell into unit cells, which typically have ∼4 mm finger length instead of 26 mm as in the case of three busbar solar cells, thereby substantially reduce the requirement of finger line conductivity. Such a low requirement of finger conductivity has enabled diverse metallization schemes to be successfully applied to many cell designs to reduce silver consumption and to be integrated into modules easily. In this paper, we present the module integration results of silicon heterojunction solar cells using various metallization schemes developed within Meyer Burger group, including fine line silver screen printing down to 80 mg per 6 inch bifacial cell, inkjet direct silver printing down to 10 mg per 6 inch monofacial cell, inkjet masking and nickel/copper plating to finger thickness as low as 1 µm on 6 inch monofacial cell. We demonstrate the high durability of these modules with extensive thermal cycling tests.
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