Reconfigurable liquid metal circuits by Laplace pressure shaping

We report reconfigurable circuits formed by liquid metal shaping with <10 pounds per square inch (psi) Laplace and vacuum pressures. Laplace pressure drives liquid metals into microreplicated trenches, and upon release of vacuum, the liquid metal dewets into droplets that are compacted to 10–100× less area than when in the channel. Experimental validation includes measurements of actuation speeds exceeding 30 cm/s, simple erasable resistive networks, and switchable 4.5 GHz antennas. Such capability may be of value for next generation of simple electronic switches, tunable antennas, adaptive reflectors, and switchable metamaterials.