聚酰亚胺
共聚物
玻璃化转变
材料科学
极限抗拉强度
高分子化学
结晶度
马来酸酐
降冰片烯
单体
化学工程
复合材料
聚合物
图层(电子)
工程类
作者
Zhigeng Chen,Sen Zhang,Qi Feng,Yancheng Wu,Shumei Liu,Jianqing Zhao
标识
DOI:10.1002/macp.202000085
摘要
Abstract Both the formation of insoluble salt for aliphatic diamines and the poor reactivity for aliphatic dianhydrides result in semi‐aromatic polyimide (SAPI) with low molecular weight and, thereby, in highly brittle SAPI films in nature. To solve the above problems, a cyclic‐olefin copolymer synthesized from norbornene and maleic anhydride is used as the third monomer (crosslinking agent) to prepare the crosslinked SAPI (cSAPI) films. The relative viscosity of the precursor solution of cSAPI is increased with the loading of cyclic‐olefin copolymer, giving rise to the improvement in mechanical and thermal properties of cSAPI films. The tensile modulus, tensile strength, and elongation at break of cSAPI film with 5 wt% cyclic‐olefin copolymer are increased to 4.49 GPa, 137 MPa, and 14.9% from 3.57 GPa, 111 MPa, and 7.6%, respectively, compared to those of the baseline SAPI film. Meanwhile, the glass transition temperature of cSAPI films is increased to 282 from 270 °C of the SAPI film, which is advantageous to better meet the requirement for high‐temperature manufacturing processes such as lead‐free solder reflowing. In addition, all cSAPI films exhibit good optical transparency in the entire visible region.
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