材料科学
共晶体系
复合数
相变材料
聚合物
盐(化学)
热能储存
热的
相变
相(物质)
热稳定性
储能
复合材料
盐溶液
化学工程
微观结构
化学
有机化学
工程物理
气象学
工程类
功率(物理)
物理
生物
量子力学
生态学
作者
Guochen Sang,Haonan Zeng,Zhiqiang Guo,Hongzhi Cui,Yangkai Zhang,Xiaoling Cui,Lei Zhang,Weixiao Han
标识
DOI:10.1016/j.jobe.2022.105010
摘要
The inorganic phase change material (PCM) is a promising energy storage material in the construction field because of their characteristics, such as high latent heat, low price and nonflammability. However, from the perspective of construction engineering applications, conventional inorganic phase change materials have some inherent performance defects, such as high phase change temperature , phase separation and leakage. To overcome these performance deficiencies, a novel eutectic hydrated salt/polymer hydrogel composite form-stable phase change material (HP-FSPCM) suitable for building thermal storage was developed, which used Na 2 SO 4 ·10H 2 O–Na 2 CO 3 ·10H 2 O eutectic salt (SCES) as PCM, sodium polyacrylate (PAAS) as thickener and packaging material, borax as nucleating agent and flake graphite as thermal conductivity enhancer. The phase change temperature and crystal structure characteristics of SCES were analyzed by means of step cooling curve method and X-ray diffraction technique (XRD). The microstructure and thermal properties of HP-FSPCM were tested and analyzed by scanning electron microscopy (SEM), differential scanning calorimeter (DSC) and transient planar thermal conductivity instrument. The test results showed that the cross-linked network formed by PAAS can eliminate the phase separation and leakage of SCES, and the latent heat value, melting temperature and crystallization temperature of HP-FSPCM were 165.5 J/g, 22.4 °C and 13.8 °C, respectively. The thermal cycle reliability of HP-FSPCM was tested, the latent heat loss of HP-FSPCM was only 2.2% after 300 thermal cycles. • A novel HP-FSPCM suitable for building thermal storage was developed. • PAAS can effectively restrict phase separation and encapsulate SCES. • The HP-FSPCM maintains good thermal reliability after 300 thermal cycles.
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