材料科学
焊接
夹紧
复合材料
点焊
接触面积
微观结构
抗剪强度(土壤)
冷焊
剪切(地质)
超声波焊接
搭接接头
冶金
热影响区
气体保护金属极电弧焊
机械工程
环境科学
土壤科学
工程类
土壤水分
作者
Kuan-Chieh Hu,Ing-Juang Lin,Ziyuan Liu,Jhe-Yu Lin
标识
DOI:10.1080/13621718.2023.2213580
摘要
In this study, the effect of bonding surface conditions on the strength evolution of Cu/Cu joints during ultrasonic welding was investigated. Lap shear tests and microstructure characterisation revealed that contact area formation could be affected by bonding surface conditions and clamping force. That is, the fraction of contact area quickly evolved with smoother bonding surfaces, leading to a rapid strength increase to base metal fracture (1100 N of lap shear load after 1.0 s of welding). Comparatively, rough surface combinations exhibited a slow strength evolution owing to a lower fraction of contact areas. To overcome this situation, a higher clamping force was employed to facilitate contact area formation (1100 N of lap shear load after 0.5 s of welding).
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