材料科学
结晶度
薄脆饼
晶界
溅射沉积
蓝宝石
外延
化学气相沉积
石墨烯
光电子学
单晶
退火(玻璃)
Crystal(编程语言)
薄膜
溅射
纳米技术
复合材料
结晶学
光学
微观结构
物理
化学
程序设计语言
激光器
计算机科学
图层(电子)
作者
Yeshu Zhu,Jincan Zhang,Ting Cheng,Jilin Tang,Hongwei Duan,Zhaoning Hu,Jiaxin Shao,Shiwei Wang,Mingyue Wei,Haotian Wu,Ang Li,Sheng Li,Osman Balcı,Sachin M. Shinde,Hamideh Ramezani,Luda Wang,Li Lin,Andrea C. Ferrari,Boris I. Yakobson,Hailin Peng,Kaicheng Jia,Zhongfan Liu
标识
DOI:10.1002/adma.202308802
摘要
Abstract Single‐crystal graphene (SCG) wafers are needed to enable mass‐electronics and optoelectronics owing to their excellent properties and compatibility with silicon‐based technology. Controlled synthesis of high‐quality SCG wafers can be done exploiting single‐crystal Cu(111) substrates as epitaxial growth substrates recently. However, current Cu(111) films prepared by magnetron sputtering on single‐crystal sapphire wafers still suffer from in‐plane twin boundaries, which degrade the SCG chemical vapor deposition. Here, it is shown how to eliminate twin boundaries on Cu and achieve 4 in. Cu(111) wafers with ≈95% crystallinity. The introduction of a temperature gradient on Cu films with designed texture during annealing drives abnormal grain growth across the whole Cu wafer. In‐plane twin boundaries are eliminated via migration of out‐of‐plane grain boundaries. SCG wafers grown on the resulting single‐crystal Cu(111) substrates exhibit improved crystallinity with >97% aligned graphene domains. As‐synthesized SCG wafers exhibit an average carrier mobility up to 7284 cm 2 V −1 s −1 at room temperature from 103 devices and a uniform sheet resistance with only 5% deviation in 4 in. region.
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