硅光子学
光子学
耦合损耗
硅
光电子学
波导管
材料科学
激光器
联轴节(管道)
GSM演进的增强数据速率
炸薯条
光学
混合硅激光器
物理
光纤
电信
计算机科学
冶金
作者
An He,Yiou Cui,Jinlong Xiang,Wenqi Wei,Zihao Wang,Ting Wang,Xuhan Guo,Yikai Su
标识
DOI:10.1002/lpor.202300100
摘要
Abstract Silicon photonics is becoming a competitive technology to settle the issues of power and speed in data centers and computing systems. However, the absence of an on‐chip light source restricts the wide and deep application of silicon photonics. Essentially, efficient edge coupling from a Si‐based III‐V laser to silicon photonic components remains the major obstacle for on‐chip integration. Here, two compact edge couplers with ultra‐low coupling loss and eased fabrication for the light transmission from a Si‐based III‐V laser to Si 3 N 4 waveguide are realized. An ultra‐low laser‐to‐chip coupling loss of only 1.175 dB for the butt coupling of a Si‐based InAs QD laser is experimentally demonstrated with high alignment tolerance. The strategies presented here provide a competitive solution for realizing ultra‐efficient integration of Si‐based light sources and silicon photonic components.
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