材料科学
集成光学
集成电路封装
光子学
电子包装
光电子学
光子集成电路
集成电路
复合材料
出处
期刊:Journal of Electronic Packaging
[ASME International]
日期:2024-06-04
卷期号:147 (1)
摘要
Abstract The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional (2D) and three-dimensional (3D) heterogeneous integration of application specific IC (ASIC) switch, PIC, and EIC w/o bridges, and heterogeneous integration of ASIC switch, PIC, and EIC on glass substrate will be discussed. Some recommendations will be provided.
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