Lv117
90 积分 2023-03-25 加入
Parameter extraction method for Cauer model considering dynamic thermal diffusion boundaries in IGBT module
7天前
已完结
Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation
7天前
已完结
Degradation mechanisms-based reliability modeling for metallized film capacitors under temperature and voltage stresses
7天前
已完结
Degradation mechanisms-based reliability modeling for metallized film capacitors under temperature and voltage stresses
7天前
已完结
Multi-physics coupling analysis of high-power IGBT module bonding wires fault considering stray inductance of main circuit
7天前
已完结
A review on warpage measurement metrologies for advanced electronic packaging
11天前
已完结
Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress
11天前
已完结
Analytical modeling of thermo-mechanical stress for bond wire of IGBT module
11天前
已完结
Stress–strain behavior of Cu on the AMB‐Si3N4 substrate undergoing thermal cycles via in situ strain measurement
11天前
已完结
Warpage Analysis and Optimization of IGBT Package Module in Reflow Process
11天前
已完结
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