Effect of thermal activation energy on the structure and conductivity corrosion resistance of Cr doped TiN films on metal bipolar plate

Cr doped TiN films were prepared on metal substrates via heating magnetron sputtering at different deposition temperatures (200 °C–350 °C). Vacuum thermal activation energy caused by heating obviously affect the microstructure, hydrophobicity, conductivity and corrosion resistance performance which were systematically investigated. The thickness of the Cr doped TiN films reduced from 573.1 nm to 487.5 nm with the elevating substrate temperature, increasing the films density and hydrophobicity. The maximum water contact Angle is 115.86° and minimum interfacial contact resistance (ICR) is 3.62 mΩ cm 2 at 350 °C of which the electrical conductivity completely satisfy with the DOE target (<10 mΩ cm 2 ), indicating a potential application of Cr doped TiN films on stainless steel (SS) for metal bipolar plate. • Cr doped TiN films have been prepared by heating magnetron sputtering. • Vacuum thermal activation energy affects the performance of Cr doped TiN films. • The growth structure and roughness of Cr doped TiN films with thermal energy have been studied. • Cr doped TiN film with excellent hydrophobicity and conductivity has been obtained at 350 °C. • Cr doped TiN films on SS possess better performance than that on Al substrate.