Thermal conductive nylon 6 composites with hybrid fillers prepared through reaction during extrusion

Currently, heat dissipation has become one of the key points to the development of novel electronic industry due to the process of miniaturization and integration, while the demand of heat dissipation could not be satisfied by the commonly used polymers. Plenty of methods to promote the thermal conductivity involve complicated steps, which hinder the feasibility of industrial application. In this work, a multi-level local thermal conductive network was designed through the reaction of amino group and epoxy group on the surface of specific fillers in the process of melt mixing to improve the thermal conductivity. The thermal conductivity of the composite prepared with reaction during extrusion was 2.121 W m−1 K−1 at 50 wt% filler content, which is better than similar combination without reaction (1.87 W m−1 K−1). Improved thermal conductivity can be attributed to the synergistic effect of glass fiber (GF) and boron nitride (BN) modified by γ-glycidoxypropyltrimethoxysilane (KH560) and aminopropyl-trimethoxysilane (KH550), respectively. This convenient strategy provides a promising method to further constructing thermal conductive network with enhanced industrial application.