国家（计算机科学）
铜
材料科学
高分子科学
计算机科学
冶金
程序设计语言
出处
期刊：IEEE Transactions on Components, Packaging and Manufacturing Technology
[Institute of Electrical and Electronics Engineers]
日期：2024-03-01
卷期号：14 (3): 376-396
被引量：1
标识
DOI：10.1109/tcpmt.2024.3367985
摘要
In this study, the state of the art of Cu–Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges (opportunities), advantages and disadvantages, and examples of Cu–Cu bumpless HB. Also, some recommendations will be provided.
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