材料科学
环氧树脂
涂层
可靠性(半导体)
复合材料
电压
局部放电
高压
功率半导体器件
电源模块
电气工程
光电子学
功率(物理)
工程类
物理
量子力学
作者
Youcai Liang,Gaojia Zhu,Gongxuan Lü,Yunhui Mei
标识
DOI:10.1007/s10854-022-08865-8
摘要
The development of a high-voltage power semiconductor device puts forward higher requirements for its electrical insulation materials. In this paper, an epoxy/SiC nonlinear field-dependent conductivity (FDC) coating material was reported to relieve its thermo-mechanical stresses during device operation. It was exciting that the coating could improve both partial discharge performance and insulation reliability for high-voltage power device packaging. This coating technology can improve the partial discharge inception voltage (PDIV) of power devices by a maximum of more than 86.2%. Based on the thermal shocking test, the PDIV of the device still exceeds 10 kV even after 1000 cycles. It was believed that the FDC insulation capable of forming a thin coating could be suitable for high-voltage power device packaging with good reliability because of reducing thermo-mechanical stresses greatly.
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