胶粘剂
乙二醇
PEG比率
超分子化学
氢键
材料科学
粘附
高分子化学
邻苯三酚
多酚
粘接
化学工程
化学
有机化学
分子
纳米技术
复合材料
图层(电子)
经济
工程类
抗氧化剂
财务
作者
Hanru Liu,Huimin Geng,Xiaohui Zhang,Xu Wang,Jingcheng Hao,Jiwei Cui
标识
DOI:10.1002/marc.202100830
摘要
The rapid and facile synthesis of hot melt super glue (HMSG) via the formation of adhesive supramolecular networks between catechol or pyrogallol hydroxyl groups (-OH) of polyphenols and repeat units (-CH2 CH2 O-) of poly(ethylene glycol) (PEG) based on hydrogen bonds is reported. The adhesion strength of HMSG, processed by heating-cooling of polyphenols and PEG without additional solvents, can be tuned up to 8.8 MPa via changing the molecular weight of PEG and the ratio of hydrogen bonding donors and receptors. The advantages of the reported HMSG lie in the ease and scalability of the assembly process, rapid adhesion on various substrates with excellent processability, resistance of low temperature and organic solvents, and recyclable adhesion strength. The solvent-free HMSG represents a promising adhesive supramolecular network to expand the versatility and application of polyphenol-based materials.
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