材料科学
电介质
电容器
介电损耗
半导体
介电常数
复合材料
无定形固体
电子线路
带隙
光电子学
电气工程
电压
化学
工程类
有机化学
作者
Jun Gao,Do‐Kyun Kwon,Steven E. Perini,Jeffery Long,Shihai Zhang,Michael T. Lanagan
摘要
Thin and flexible glass ribbons can be rolled into a film capacitor structures for power electronic circuits. Glass has excellent electrical properties and is a leading candidate to replace polymer films for high-temperature applications. The dielectric properties of a low-alkali aluminoborosilicate glass were characterized up to temperatures of 400°C. Low-field permittivity values of 6 with dielectric loss below 0.01 were found for temperatures below 300°C. The dielectric breakdown strength exceeded 5 MV/cm for temperature of 400°C and high-field polarization measurements showed that glass has over 95% energy efficiency at temperatures of 200°C, which is a target temperature for high-temperature power electronic circuits driven by wide bandgap semiconductor devices.
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