材料科学
循环伏安法
超级电容器
电容
纳米材料
介电谱
扫描电子显微镜
电化学
化学工程
纳米结构
电解质
镍
纳米技术
分析化学(期刊)
电极
复合材料
冶金
色谱法
工程类
物理化学
化学
作者
Jian Huang,Xiao Zheng,Zhicai Xing,Lecheng Tian
出处
期刊:NANO
[World Scientific]
日期:2022-12-15
卷期号:17 (13)
标识
DOI:10.1142/s1793292022500989
摘要
Two kinds of CuO nanomaterials with different morphologies were grown directly on surface of nickel foam using electrochemical deposition technology, and their electrochemical properties were studied. The morphology of CuO at different deposition voltages (spherical and wheat spike) were observed by field emission scanning electron microscopy. The results showed that the deposition voltage is the main factor affecting the morphology of CuO. In addition, X-ray diffraction results showed that the prepared samples are CuO materials. The electrochemical properties of CuO nanostructures were studied by cyclic voltammetry, galvanostatic charge/discharge measurements and electrochemical impedance spectroscopy. These test results showed that the specific capacitance of CuO nanomaterials was largely related to the morphology of the material. Compared with CuO nanospheres thin films, wheat spike CuO thin films had a more prominent specific capacitance. The wheat spike CuO array film has a specific capacitance of 120[Formula: see text]mF/cm 2 at a current density of 1[Formula: see text]mA/cm 2 in 1[Formula: see text]mol/L sodium sulfate electrolyte.
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