醋酸
氧化物
铜
无机化学
化学
氢氧化物
X射线光电子能谱
氧化铜
电化学
蚀刻(微加工)
核化学
化学工程
有机化学
电极
物理化学
图层(电子)
工程类
作者
K. Chávez,Dennis W. Hess
出处
期刊:Journal of The Electrochemical Society
[The Electrochemical Society]
日期:2001-01-01
卷期号:148 (11): G640-G640
被引量:255
摘要
The removal of copper oxide using acetic acid at low temperatures was investigated. Acetic acid removes a variety of copper oxides, including cuprous oxide, cupric oxide, and cupric hydroxide without attacking the underlying copper film. The removal of these oxides was determined by X-ray photoelectron spectroscopy. Acetic acid can tolerate up to 4 vol % water dilution without hindering the oxide removal while producing an oxide-free surface. However, if a deionized water rinse is performed after an acetic acid treatment, a surface film of cupric hydroxide forms immediately. An acetic acid treatment at 35°C without a water rinse removes the native copper oxide and produces an oxide-free, streak-free copper surface. © 2001 The Electrochemical Society. All rights reserved.
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