材料科学
涂层
复合数
复合材料
导电体
耐久性
纤维
图层(电子)
剪切(物理)
柔性电子器件
纳米技术
电阻率和电导率
生物相容性
电气工程
工程类
冶金
作者
Gunhee Lee,Do Hoon Lee,Woojin Jeon,Ji‐Hwan Yoon,Kwangguk Ahn,Kum Seok Nam,Min Kyoung Kim,Jun Kyu Kim,Yong Hoe Koo,Jinmyoung Joo,WooChul Jung,Jaehong Lee,Jaewook Nam,Seongjun Park,Jae‐Woong Jeong,Steve Park
标识
DOI:10.1038/s41467-023-39928-x
摘要
Deformable semi-solid liquid metal particles (LMP) have emerged as a promising substitute for rigid conductive fillers due to their excellent electrical properties and stable conductance under strain. However, achieving a compact and robust coating of LMP on fibers remains a persistent challenge, mainly due to the incompatibility of conventional coating techniques with LMP. Additionally, the limited durability and absence of initial electrical conductivity of LMP restrict their widespread application. In this study, we propose a solution process that robustly and compactly assembles mechanically durable and initially conductive LMP on fibers. Specifically, we present a shearing-based deposition of polymer-attached LMP followed by additional coating with CNT-attached LMP to create bi-layer LMP composite with exceptional durability, electrical conductivity, stretchability, and biocompatibility on various fibers. The versatility and reliability of this manufacturing strategy for 1D electronics are demonstrated through the development of sewn electrical circuits, smart clothes, stretchable biointerfaced fiber, and multifunctional fiber probes.
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